Some details of the forthcoming mobile processor Huawei new generation – Huawei Kirin 970 has been leaked.
According to the leaks, the chip will be produced by TSMC’s, using 10-nanometer process technology which will be based on FinFET technology. Recall that the current processor Huawei Kirin 960 is made on 16-nanometer technology.
According to available information, Huawei Kirin 970 processor will receive eight cores based on ARM Cortex A73 architecture and graphic solution ARM Heimdallr MP.
Moreover, it will be the first chip with GPU data. In addition, it is reported that Kirim 970 will support almost all frequency bands and mobile aggregation 5 carriers.
Previous leaks showed that at 8-core processor Huawei Kirin 970 with two cluster of cores are used: 4 core ARM Cortex-A73 and 4 cores ARM Cortex-A53. The maximum operating frequency may be in the range 2.8-3.0 GHz. Device attributed to the use of Cat modem. 12 LTE. Stay tuned for more information on Huawei Kirin 970 mobile processor.