Intel Core i9 7900X will be the second processor in power of the new series Skylake-X that Intel will present in the month of June together with Kaby Lake-X. Both will replace the current LGA2011-v3 boards on the high performance platform, HEDT, and will share the new LGA-2066 and X299 chipset soclets.
If Kaby Lake-X will offer processors with up to four cores, Skylake-X will deliver 6, 8, 10 and up to 12 physical (dual-threaded) cores of native processing, plus features such as 13.75 MB cache, up to 44 PCIe 3.0 lines and support for four-channel DDR4 memory.
SiSoft Sandra is one of the best benchmarks for details on unprecedented hardware features that has not yet hit the market. It’s what they show us in Overclockers and there are some interesting changes of Intel Core i9 7900X.
Intel Core i9 7900X will be the 10-core processor Skylake-X, but according to the information would have a much higher work frequency than previously thought: 4 GHz and 4.5 GHz in Turbo Boost mode, which is a lot for 20 threads of prosecution.
Also, cited is a TDP consumption value much higher than the estimated: 175 watts. Intel Core i9 7900X would include 13.73 MB of shared third-level cache and 10 MB of L2 cache, 1 MB for each core.
We do not know if these data are a statement of intentions of Intel in terms of processor power and reference to AMD’s RYZEN. The board listed is an X299 Gigabyte AORUS Gaming 7, but it is the least because it is certain that the new HEDT processors will have support from all major manufacturers.
We will have official details soon. According to the latest information, Intel Core i9 7900X and other CPUs of this platform will be presented on June 12 under the PC Gaming Show E3, which this year is sponsored by Intel.