A leak has enabled us to see the specifications of Qualcomm Snapdragon 845, a next-generation SoC from Qualcomm that is emerging as one of the most important and used solutions of 2018.
According to information published by different Asian media this new silicon Qualcomm Snapdragon 845 will mount an eight-core processor divided into two blocks. The first block will add four high performance cores based on the ARM Cortex-A75 architecture, on which Qualcomm could add small improvements that further increase performance.
The second block will consist of four low-power Cortex-A53 cores, which will operate intelligently when we are performing simple tasks that do not require high processing power.
Thanks to this balance between blocks of high performance and low consumption, it will be possible to maintain a greater overall efficiency and extend the life of the battery.
The GPU will be an Adreno 630, a solution that promises to be very powerful and that will allow to move next generation 3D games with high levels of quality and resolution without problem, maintaining an absolute fluidity.
The presence of a high performance 4G LTE modem with speeds of up to 1.2 Gbps and the support of LPDDR4X memories and UFS 2.1 storage.
It is expected that the Qualcomm Snapdragon 845 will be available from the first quarter of 2018 and that it will be manufactured in an improved 10 nm process, that is, the version known as “Low Power Plus”.
This SoC Qualcomm Snapdragon 845 will give life to terminals as expected as the Galaxy S9, and is likely to also be present in the new top of Sony, Xioami and OnePlus.