Qualcomm had officially revealed the most awaited new top-end SoC but did not give specific details. Yes, we are talking about the Snapdragon 845, a chip that is destined to become the star component of next-generation top-of-range smartphones.
We did not know how long it would take the San Diego giant to confirm all the key specifications of the Snapdragon 845, but fortunately, they have been faster than we expected, now we were able to confirm all their features.
As we anticipated in previous news this new SoC keeps the eight-core CPU divided into two large blocks of four cores each. The basis of the first is the Cortex-A75 architecture of high performance and the second is the Cortex-A55 of low consumption.
On this basis Qualcomm applies a customization that in this case is known as Kryo 385 that improves performance. In the case of the first block, frequencies of up to 2.8 GHz can be achieved, while in the second, the top is 1.8 GHz. It promises a 25% performance improvement over the Snapdragon 835 at the CPU level.
As expected the GPU is an Adreno 630 that is ready for virtual reality as it supports dual screen configurations with 2K resolution at 120 Hz and has a “Visual Processing Subsystem”, which in theory should improve performance. Compared to the Adreno 540 it promises 30% more performance and 30% more energy efficiency.
Otherwise, the SoC has a Hexagon 685 for artificial intelligence, support for WiFi AD and mounts a high-performance LTE X20 modem capable of reaching maximum peak peaks of up to 1.2 Gbps.
The Snapdragon 845 will be manufactured in the process of 10 nm and will be used in flagships such as the Galaxy S9 and Galaxy Note 9, and also in the next star terminals of companies such as Xiaomi, OnePlus and HTC.
Pros of Snapdragon 845:
Better performance improved up to 25% than its predecessor
30% energy efficient
Release date is far